1. Especially designed for BGA chips repair.2. CPU planting tin, dynamic leveling of planting tin net, protect chip more secure.3. Avoid tin messing caused by the deformation of steel mesh efficiently.4.Replace the iPhone front camera and infrared camera cable. It is a safer fixture to avoid camera blurring caused by heating.5.: Fixed iPhone fingerprints And dot-matrix flex cable.
Button R1 / R2 Board Connector Flex Cable for PS5 Controllers High Quality
3,60 €
XIAOMI Redmi GO - Battery cover Blue Original
11,72 €
Multifunctional Pressure Reducing Silicon Pad For Reballing BGA CPU IC
13,28 €
Silicon Pad Especially designed for BGA chips repair.
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